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基于DIC的印制线路板三维形貌高精度测量
High-Accuracy Three Dimensional Shape Measurement of Printed Circuit Board Based on Digital Image Correlation
投稿时间: 2017-01-09  最后修改时间: 2017-03-07
DOI:
中文关键词:  数字图像相关  印制线路板  三维形貌
英文关键词:Digital image correlation  Printed circuit board  Three-dimensional shape
基金项目:中国科学院战略性先导科技专项(B类);国家自然科学基金项目
作者单位E-mail
张弦 南京中迅微传感技术有限公司 1141796989@qq.com 
苏勇 中国科技大学 suyong@ustc.edu.cn 
张勇 南京中迅微传感技术有限公司 zhangyong@pmlab.com.cn 
丁晓华 国防科技大学  
于起峰 国防科技大学  
张青川 中国科技大学 zhangqc@ustc.edu.cn 
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中文摘要:
      在生产过程中对产品三维形貌的高精度实时测量是有效的质量监控手段,具有迫切的需求。本文基于三维数字图像相关(DIC-3D)方法,全场测量了印制线路板上的台阶状焊点和印制线路,得到焊点大小、高度和印制线路线宽、线高等三维形貌数字图像数据;使用台阶仪采集面内和离面形貌数据,并进行比较。实验结果表明,三维数字图像相关方法在测量印制线路板形貌时,可测量出十数微米高的印刷线路台阶,精度达3微米;对500X500像素图像,在i7 4790kCPU硬件条件,步长3像素、子区19?9像素的参数下,立体图像的重建速度小于1秒,可满足线路板的在线实时检测。
英文摘要:
      High-accuracy and real-time three dimensional shape measurement is an ideal tool for quality control in production, with an urgent demand. Based on three dimensional digital image correlation(3D-DIC), this paper performs shape measurements for stair-step welding spots and printed wires on circuit boards; the three dimensional shape of the circuit boards are successfully reconstructed, and the sizes and depths of both welding spots and printed wires are identified with high accuracy. To evaluate the performance of 3D-DIC, a Stylus Profiler is employed to conduct in-plane and out-plane shape measurement for the second PCB, and comparisons are made between results of 3D-DIC and Stylus Profiler. The experimental results demonstrate that: 1) The printed wires with several tens ?m depth can be measured with an accuracy of 3?m by 3D-DIC; 2) The 3D reconstruction time for a 500?00 image is less than 1 second with a grid step 3 and a subset size 19 for a consumer-grade computer (i7 4790k CPU,16G memory), and it meets the demands of on-line and real-time detection for PCB.
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