| 陈建桥.电镀法测表面应力[J].实验力学,1991,6(4): |
| 电镀法测表面应力 |
| Surface Stress Measurement by Means of the Electroplating Method |
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| DOI： |
| 中文关键词: 电镀法 斑点 表面应力 高温应力 |
| 英文关键词:electroplating,flecks,alternating stress,high temperature stress |
| 基金项目: |
| 陈建桥 |
| 华中理工大学 |
| 摘要点击次数: 216 |
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| 中文摘要: |
| 电镀法是在被测物表面镀铜或镀镍,在交变应力作用下,利用镀层内的组织变化来测定表面弹性应力应变的方法。本文简述电镀法原理,讨论其在实物交变应力及高温应力测量中的应用。 |
| 英文摘要: |
| It is the electroplating method by which the distribution of alternating elastic surface stress and strain of the object plated with copper or rickel can be measured based on the structural change in the deposited layer.This paper describes the basis and |
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