| Yasuyuki Morita*,Kazuo Arakawa,Mitsugu Todo.Experimental and Numerical Analysis of Thermal Deformation of Electronic Packages,QFP and MCM[J].实验力学,2006,21(1):11~19 |
| Experimental and Numerical Analysis of Thermal Deformation of Electronic Packages,QFP and MCM |
| Experimental and Numerical Analysis of Thermal Deformation of Electronic Packages,QFP and MCM |
| 投稿时间：2005-04-25 |
| DOI： |
| 中文关键词: |
| 英文关键词:electronic package Moiré interferometry thermal deformation displacement field QFP MCM PCB coefficient of thermal expansion finite element analysis |
| 基金项目: |
| 作者 | 单位 | | Yasuyuki Morita* | Research Institute for Applied Mechanics, Kyushu University, 6 1 Kasuga koen, Kasuga shi, Fukuoka 816 8580, Japan | | Kazuo Arakawa | Research Institute for Applied Mechanics, Kyushu University, 6 1 Kasuga koen, Kasuga shi, Fukuoka 816 8580, Japan | | Mitsugu Todo | Research Institute for Applied Mechanics, Kyushu University, 6 1 Kasuga koen, Kasuga shi, Fukuoka 816 8580, Japan |
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| 中文摘要: |
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| 英文摘要: |
| Moiré inteferometry and FEA (finite element analysis) were used to evaluate the thermal deformation of two electronic packages, QFP (quad flat package) and MCM (multi chip module).Thermal loading was applied by cooling the packages from 100℃ to room temperature (25℃). Moiré fringes were obtained on the cross sections of the packages to clarify the effect of the CTE (coefficient of thermal expansion) mismatch of the micro components, such as silicon, metal and resin. In QFP, the effects of packaging resin and PCB (printed circuit board) on the thermal deformation were investigated. The effect of location of three silicon chips in MCM was also examined. |
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