| 苏飞*,王光周,杨会平,王晓明.双列直插器件(DIP)焊接过程中的应力评价[J].实验力学,2010,25(6):619~624 |
| 双列直插器件(DIP)焊接过程中的应力评价 |
| Stress Evaluation of Dual In-Line Devices in Welding Process |
| 投稿时间：2010-01-27 修订日期：2010-05-12 |
| DOI： |
| 中文关键词: 双列直插器件(DIP) 云纹干涉法 有限元 应力评价 |
| 英文关键词:dual in-line package devices Moiré interferometry finite element method stress evaluation |
| 基金项目: |
|
| 摘要点击次数: 397 |
| 全文下载次数: 447 |
| 中文摘要: |
| 为探讨陶瓷封装双列直插器件在焊接后出现开裂的问题，应用云纹干涉法和Twyman/Green干涉法实时测试了该类型器件在焊接过程中的面内和离面变形情况，并将测试数据与有限元法相结合，评估了焊接过程中器件内部因印制板变形而产生的应力大小。由此对原先"焊接导致开裂"的说法做出了评价。同时，通过器件的变形测试，探讨了优化焊接工艺的方法。研究结果表明，焊接顺序对器件内部热应力和器件变形影响不大，而适当提高器件高度可有效减小焊接时的热应力。 |
| 英文摘要: |
| To investigate the crazing problem emerged after welding process of dual in-line ceramic package devices, the in-plane and out-of-plane deformation of the devices during welding process was real-timely tested based on moiré interferometry and Twyman/Green interferometry. The device internal stress field produced by deformation due to welding process was evaluated based on the combination of experimental data and finite element method. Thus, the former viewpoint "welding leads to crazing" was also commented. At the same time, optimization of welding technology was discussed with the aid of experimental results of deformation. Results show that the welding sequence has little impact on the device internal thermal stress and deformation, but appropriately increasing device height can effectively reduce the level of thermal stress during welding. |
| 查看全文 下载PDF阅读器 |
| 关闭 |
