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张保山,王永平,李志勇,彭良明*.60Si2Mn螺旋弹簧的压缩应力松弛行为与贮存寿命预测[J].实验力学,2011,26(6):699~706
60Si2Mn螺旋弹簧的压缩应力松弛行为与贮存寿命预测
On the Compressive Stress Relaxation Behavior and Storage Life Prediction of 60Si2Mn Helical Springs
投稿时间:2011-09-26  修订日期:2011-11-07
DOI:
中文关键词:  应力松弛  松弛速率  塑性应变  激活能  贮存寿命预测
英文关键词:stress relaxation  relaxation rate  plastic strain  activation energy  storage life prediction
基金项目:
作者单位
张保山 中国科学技术大学 中国科学院材料力学行为与设计重点实验室, 合肥230026 
王永平 北京星航机电设备厂, 北京100074 
李志勇 北京星航机电设备厂, 北京100074 
彭良明* 中国科学技术大学 中国科学院材料力学行为与设计重点实验室, 合肥230026 
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中文摘要:
      为评价60Si2Mn螺旋压缩弹簧的室温松弛特性,利用InstronE3000K8953型小吨位电子动静态疲劳试验机,对其在不同温度和初始应力水平条件下进行了高温压缩加速应力松弛试验,研究了环境温度、初始应力水平对松弛行为的影响。基于粘弹性体模型, 揭示了应力松弛过程中弹性应变向塑性应变的转化特性与塑性应变随松弛时间的变化规律。在对应力松弛前后弹簧丝材金相和TEM微结构进行对比分析的基础上, 探讨了应力松弛的微观机制。结果表明,环境温度与初始应力水平对松弛速率具有显著影响。基于应力松弛过程的热激活特性,建立了60Si2Mn螺旋压缩弹簧的贮存寿命预测方程, 并对不同应力水平下弹簧的室温和高温贮存寿命进行了合理预测。
英文摘要:
      In order to evaluate the stress relaxation properties of 60Si2Mn helical springs at room temperature, the compressive accelerated stress relaxation tests at different high temperatures and under different initial stress conditions were carried out on a small Instron E3000K8953 electronic static and dynamic fatigue testing machine. The effect of ambient temperature and initial stress on the relaxation behavior was investigated. The characteristics of the transition from elastic strain to plastic strain and the variation of plastic strain along with the stress during relaxation are demonstrated based on viscoelastic model. Microscopic mechanism of stress relaxation is explored based on metallographic analysis and TEM microstructure observation for spring specimens before and after relaxation. Results show that the environmental temperature and initial stress level exerted significant effect on stress relaxation behavior. Temperature-dependent constitutive equations are established for thermal-activated stress relaxation processes, and storage life prediction of spring subjected to different stresses and at room temperature and high temperature is performed, respectively.
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