邵亚琪,郇勇*,代玉静,缪泓,张泰华.基于全场位移测量技术的微悬臂梁面内弯曲性能测试[J].实验力学,2014,29(4):441~446 |
基于全场位移测量技术的微悬臂梁面内弯曲性能测试 |
In-plane Bending Performance Test of Micro-Cantilever Based on Whole-Field Displacement Measuring Technique |
投稿时间:2013-10-28 修订日期:2014-03-25 |
DOI:10.7520/1001-4888-13-164 |
中文关键词: 微尺度 面内载荷 数字散斑相关方法 微电子机械系统 微悬臂梁 |
英文关键词:micro-scale in-plane load digital speckle correlation method (dscm) micro-electromechanical systems (mems) micro-cantilever |
基金项目:国家自然科学基金(11372323, 11025212和11272318)和中国科学院仪器设备功能开发技术创新项目资助 |
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中文摘要: |
基于自制的微力试验机和全场位移光学测量仪,建立了微尺度力学性能原位测试系统。其中微力试验机基于电磁驱动兼载荷计量原理设计,载荷量程和噪音分别为±1N和50μN。全场位移光学测量仪基于白光数字散斑相关方法研制。采用该系统对MEMS单晶硅(001)微悬臂梁进行了面内弯曲力学性能原位测试,获得了微悬臂梁末梢施力点的力-位移关系曲线,以及全场变形情况。结果显示,微悬臂梁表现出很好的弹性弯曲行为,最后在根部发生脆性断裂。根据弹性弯曲理论计算出单晶硅弹性模量为123.8GPa(±3.2%)。该技术为研究MEMS微构件的力学性能提供了一种有效的手段。 |
英文摘要: |
An in-situ testing system for micro-scale mechanical performance was developed based on a home-made micro-force testing machine and an optical whole-field displacement measuring instrument. The micro-force testing machine is designed based on principle of electromagnetic drive and load measurement with load range/noise of ±1N/50μN, respectively. The optical whole-field displacement measuring instrument was developed based on white light digital speckle correlation method with the specimen' topography acted as the generalized speckle. In-plane bending performance test of MEMS monocrystalline silicon (001) micro-cantilevers was performed by using this testing system. The force-displacement curve at the end of micro-cantilever was acquired, as well as the whole-field displacement. Results show that the micro-cantilever presents a good elastic bending behavior and finally fractures at the root. Young's modulus of monocrystalline silicon (001) is determined as 123.8GPa (±3.2%) based on the elastic bending theory. This technique provides a feasible approach for studying the mechanical properties of MEMS micro-structures. |
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