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王园园,邓华夏*,张进,于连栋.考虑强结合界面的磁流变弹性体力学性能分析[J].实验力学,2018,33(1):31~40
考虑强结合界面的磁流变弹性体力学性能分析
Mechanical property analysis of magnetorheological elastomer by taking into account strong bonging interface
投稿时间: 2017-03-17  最后修改时间: 2017-05-10
DOI:10.7520/1001-4888-17-067
中文关键词:  磁流变弹性体  强结合界面  阻尼  模量  磁偶极子模型
英文关键词:Magnetorheological elastomers (MRE)  strong bonding interface  damping  modulus  magnetic dipole model
基金项目:国家自然科学基金(51575156, 51675156)和中央高校基本科研业务费(JZ2014HGBZ0346)
作者单位
王园园 合肥工业大学 仪器科学与光电工程学院 安徽 230009 
邓华夏* 合肥工业大学 仪器科学与光电工程学院 安徽 230009 
张进 合肥工业大学 仪器科学与光电工程学院 安徽 230009 
于连栋 合肥工业大学 仪器科学与光电工程学院 安徽 230009 
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中文摘要:
      磁流变弹性体是将铁磁性颗粒填充到非磁性的聚合物基体中,通过固化作用形成的柱状或链状结构。目前,研究磁流变弹性体的力学模型主要是磁偶极子模型以及修正的磁偶极子模型。这些模型考虑了颗粒之间的相互作用,但尚未涉及颗粒和基体之间的相互作用。本文在考虑颗粒和基体相互作用的基础上,基于剪滞法理论计算出强结合界面磁流变弹性体模量和阻尼特性。通过实验制备硅橡胶基的磁流变弹性体,并在应变幅值较小时测试其剪切储能模量和阻尼因子,详细分析不同的应变幅值和磁场强度对磁流变弹性体性能的影响。理论结果与实验结果相符,验证了本文关于强结合界面性能分析的正确性。
英文摘要:
      Magnetorheological elastomer (MRE) is a columnar or chain structure, which is formed by filling ferromagnetic particles into nonmagnetic polymer matrix and then through curing action. At present, the mechanical model used for study magnetorheological elastomer is mainly magnetic dipole model and modified magnetic dipole model. These models take into account the interaction between particles, but the interaction between particles and matrix has not yet been considered. In this paper, taking into account the interaction between particles and matrix, based on shear-lag method, the elastic modulus and damping characteristics of magnetorheological elastomer with strong bonding interface are calculated. Magnetorheological elastomer based on silicon rubber was prepared in laboratory, and under the condition of small strain amplitude, the shear modulus of energy storage and damping factor were measured, the strain amplitude and the effect of magnetic field strength on magnetorheological elastomers property were detailed analyzed. The theoretical results are in good agreement with the experimental ones, which verifies the correctness of strong bonding interface performance analysis.
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