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张弦,苏勇,张勇,丁晓华,于起峰,张青川*.基于DIC的印制线路板三维形貌高精度测量[J].实验力学,2018,33(4):499~508
基于DIC的印制线路板三维形貌高精度测量
High precision three-dimensional morphology measurement of printed circuit board based on digital image correlation
投稿时间: 2017-01-09  最后修改时间: 2017-03-07
DOI:10.7520/1001-4888-17-005
中文关键词:  数字图像相关  印制线路板  三维形貌
英文关键词:digital image correlation  printed circuit board  three-dimensional morphology
基金项目:中国科学院战略性先导科技专项(B类)(XDB22040502)和国家自然科学基金(11332010, 11627803, 11472266,11428206)资助
作者单位
张弦 南京中迅微传感技术有限公司 南京 211300 
苏勇 中科院材料力学行为和设计重点实验室 中国科学技术大学近代力学系 合肥 230027 
张勇 南京中迅微传感技术有限公司 南京 211300 
丁晓华 国防科技大学 长沙 410073 
于起峰 国防科技大学 长沙 410073 
张青川* 中科院材料力学行为和设计重点实验室 中国科学技术大学近代力学系 合肥 230027 
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中文摘要:
      生产过程中对产品三维形貌的高精度实时测量是有效的质量监控手段,具有迫切的需求。本文基于三维数字图像相关(DIC-3D)方法,全场测量了印制线路板上的台阶状焊点和印制线路,得到焊点大小、高度和印制线路线宽、线高等三维形貌数字图像数据;使用台阶仪采集面内和离面形貌数据,并进行比较。实验结果表明,三维数字图像相关方法在测量印制线路板形貌时,可测量出十数微米高的印刷线路台阶,精度达3μm;对500×500pixels图像,在i7 4790k CPU硬件条件,步长3pixels、子区19×19pixels的参数下,立体图像的重建速度小于1s,可满足线路板的在线实时检测。
英文摘要:
      In production process, high precision real-time measurement of 3D product morphology is an effective means of quality monitoring, and has urgent requirement. Based on the three-dimensional digital image correlation (DIC-3D) method, the step like solder joints and printed circuit on printed circuit board were measured in full field, three-dimensional morphology data, such as the size of solder joint, the line height and width of printed circuit etc. were obtained. The in-plane and out-plane morphology data were collected by step gauge meter and compared with that from DIC method. Experimental results show that three-dimensional digital image correlation method can measure printed line step with ten microns height, and its precision is up to 3 micron in printed circuit board morphology measurement. For 500×500 pixels image, the reconstruction speed of stereo image is less than 1 second, under the condition of i7 4790k CPU hardware, the step size 3 pixels and sub area 19×19 pixels, which can satisfy the on-line real-time detection of the circuit board.
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