| 李腾辉,姚瑞霞,于川,苏飞*.基于六步相移法的集成化显微红外光弹系统的研制[J].实验力学,2019,34(1):64~72 |
| 基于六步相移法的集成化显微红外光弹系统的研制 |
| Development of an integrated micro-infrared photoelastic system based on six-step phase-shift method |
| 投稿时间：2017-10-09 修订日期：2018-02-25 |
| DOI：10.7520/1001-4888-17-200 |
| 中文关键词: 应力 红外光弹 全自动 硅通孔(TSV) 六步相移法 |
| 英文关键词:stress infrared photoelastic automatic through silicon via six-step phase-shift method |
| 基金项目:国家自然科学基金11672340资助 |
|
| 摘要点击次数: 692 |
| 全文下载次数: 279 |
| 中文摘要: |
| 为了实现对芯片和光伏电池板的应力检测，以六步相移法为基础，使用可透过硅基的近红外光源以及相应的光学元件，开发了集红外显微镜和显微红外光弹系统为一体的全自动应力检测系统。系统开发完成后，采用标准红外1/4波片为标准件对其测试精度进行了验证，结果表明系统的相位差检测误差在2.2%以内。使用该系统对经过热循环实验的硅通孔(TSV)周围芯片的残余应力及其在热循环过程的变化规律进行了研究，并评估了其中的最大应力。该系统对于芯片以及光伏电池板的无损检测具有一定的应用价值。 |
| 英文摘要: |
| In order to detect the stress of chip and photovoltaic (PV) panels, based on six-step phase-shift method, using near infrared light source which is able permeable through silicon substrate and the corresponding optical elements, a fully automatic stress detection system was developed, which integrates infrared microscope with infrared photo-elastic system. After the system was completed, its test precision was verified by using the standard infrared 1/4 wave plate as the standard part. Result show that the error of phase difference detection is no more than 2.2%. Besides, the residual stress was tested on the chip around the through silicon via (TSV)，which was experimentally investigated by thermal cycling. The variation of TSV in its thermal cycling process was studied, and the maximum stress was evaluated. The result showed that the infrared photoelastic system is of great value for the nondestructive testing on chips and photovoltaic (PV) panels. |
| 查看全文 下载PDF阅读器 |
| 关闭 |
