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| 基于双波长红外光弹的全场内部应力自动分析技术 |
| Automatic full-field internal stress analysis technique based on dual-wavelength infrared photoelasticity |
| 投稿时间：2023-11-22 修订日期：2024-01-25 |
| DOI： |
| 中文关键词: 红外光弹 双波长 半导体 内部应力 自动光弹分析 |
| 英文关键词:infrared photoelasticity dual-wavelength semiconductor internal stress automatic photoelastic analysis |
| 基金项目:异质异构膜基材料应力的原位检测仪器 |
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| 摘要点击次数: 233 |
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| 中文摘要: |
| 红外光弹法能够实现半导体材料内部应力的无损、全场表征。现有的红外光弹去包裹方法都需要一些手动干预，这成为制约红外光弹法实用于半导体应力在线检测的关键因素。本文提出了一种基于双波长红外光弹的全场内部应力自动分析技术，即双波长种子点自动识别法。该技术根据样品各点在不同波长下的相位变化趋势，解析其中所包含真实相位值的符号和绝对值信息，自动识别出相位去包裹所需要的初始种子点，从而避免了图像分析过程中的人工介入。本文围绕所提出的技术研制了双波长红外光弹实验装置，并开展了单晶硅样品内部应力场的实验测量。本文将实验结果与已有方法进行对比，验证了本文提出方法及其装置用于全自动分析复杂应力全场分布的可靠性。 |
| 英文摘要: |
| Infrared photoelasticity method can achieve non-destructive and full-field characterization of internal stress in semiconductor materials. Most of the existing unwrapping method developed for infrared photoelasticity required some manual interventions. Lack of automated means without manual intervention was a key factor restricting the application of infrared photoelasticity to the on-line stress detection. This paper proposed an automatic full-field internal stress analysis technique based on dual-wavelength infrared photoelasticity, namely automatic seeds identification for dual wavelengths. According to the phase trend of each point in the sample at different wavelengths, the initial seeds required for phase unwrapping can be automatically identified by the symbol and absolute value of the real phase, and thus avoiding manual intervention in the whole process of photoelastic analysis. In this work, a dual-wavelength infrared photoelasticity device was developed based on the proposed technique. The results of application experiments were compared with those of other existing methods, which verified the reliability of the proposed method, and its device as well, for the automatic analysis of complex internal stress distribution. |
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