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| 基于声发射技术和有限元分析的光聚合收缩应力测试研究 |
| Research on Photopolymerization Shrinkage Stress Testing Based on Acoustic Emission Technology and Finite Element Analysis |
| 投稿时间：2024-03-19 修订日期：2024-04-01 |
| DOI： |
| 中文关键词: 光聚合树脂 三维收缩应力 声发射技术 有限元分析 无机填料 |
| 英文关键词:Photopolymerization resin Three-dimensional polymerization shrinkage Acoustic emission Finite element analysis Inorganic fillers |
| 基金项目:国家自然科学基金项目（12272276） |
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| 中文摘要: |
| 光聚合树脂因其反应条件简单、易于操作等优点在3D打印、涂层和牙齿修复等领域得到了广泛应用。然而，聚合过程中在材料与基质界面处产生的收缩应力严重影响着光聚合树脂的服役功效。因此，准确测量光聚合树脂的收缩应力对提高其服役质量至关重要。现有测试方法仅适用于单轴或轴对称条件下收缩应力的测量，难以实现对实际应用工况下三维应力的测试。本研究提出声发射技术结合有限元分析的收缩应力评估方法，证实了声发射事件数与有限元预测应力的正相关性，验证了模型准确性，并精确预测了树脂与基质界面处的应力分布。进一步研究表明，无机填料浓度对光聚合树脂固化过程中三维收缩应力的影响与基质刚度有关：在低刚度条件下，增加填料浓度可以有效降低树脂收缩应力；而在高刚度条件下，填料浓度对树脂收缩应力的影响较低。声发射技术结合有限元分析为光聚合三维收缩应力的评估提供了新的测试手段，测试结果为光聚合材料的工艺优化与功效提升提供了指导方案。 |
| 英文摘要: |
| Photopolymerizable resins are commonly used in various fields, including 3D printing, coatings, and dental restorations, due to their simple reaction conditions and ease of use. However, the shrinkage stresses that occur within the material and at the substrate interface during the polymerization process can significantly impact the performance of photopolymerized resins. Therefore, it is crucial to accurately measure the shrinkage stress in these resins to enhance their performance. Current testing methods are limited to measuring shrinkage stress under uniaxial or axisymmetric conditions, which makes it challenging to test three-dimensional stresses in practical applications. This study proposes a method for assessing shrinkage stress using acoustic emission techniques combined with finite element analysis. The method monitors the correlation between the counts of acoustic emission events and the mean stress predicted by the finite element model. This verifies the accuracy of the model and accurately predicts the stress distribution inside the resin and at the interface. Studies have shown that the concentration of inorganic filler affects the three-dimensional shrinkage stress during the curing process of photopolymerization resins, which is related to external stiffness. Enhancing the filler concentration can significantly reduce resin shrinkage stress when the environmental stiffness is low. However, in conditions of high stiffness, the impact of filler concentration on resin shrinkage stress is marginal. The integration of acoustic emission testing and finite element analysis provides a new approach to evaluating the three-dimensional shrinkage stress of photopolymerized materials. These test findings can provide valuable insights for improving processing methods and increasing material productivity. |
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